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2019 Broadcom AFEM-8092 System-in-Package in the Apple iPhone XS/XR Series Teardown Report - ResearchAndMarkets.com

DUBLIN--(BUSINESS WIRE)--The "Broadcom AFEM-8092 System-in-Package in the Apple iPhone Xs/Xr Series" report has been added to ResearchAndMarkets.com's offering. For the second year, Apple has decided to adopt innovative technology in the radio-frequency (RF) area. In 2018, Broadcom has supplied several versions of the iPhone with the same module. It features several dies: Power Amplifier, Silicon-on-Insulator Switch and Filters. The Filters are still using Avago's Microcap bonded-wafer Chip Scale Packaging (CSP) technology with Through-Silicon Vias (TSVs) enabling electrical contacts and Scandium Doped Aluminum Nitride (AlScN) as a piezoelectric material. For this special version, Broadcom has integrated two advanced features.

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